Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass SubstrateDinh, Thanh Vinh; Pagazani, Julien; Lesenechal, Dominique; Pasquet, Daniel; Descamps, Philippe; Lissorgues, Gaelle; Nicole, Pierre · IEEE Transactions on Components, Packaging and Manufacturing Technology · 2015

[IEEE 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) - Dresden, Germany (2013.09.26-2013.09.27)] 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) - Model of mutual coupling between two bonding wires on glass substrateDinh, Thanh Vinh; Pasquet, Daniel; Descamps, Philippe; Lesenechal, Dominique; Pagazani, Julien; Lissorgues, Gaelle; Nicole, Pierre · 2013

[IEEE 2014 20th International Conference on Microwaves, Radar, and Wireless Communications (MIKON) - Gdansk, Poland (2014.6.16-2014.6.18)] 2014 20th International Conference on Microwaves, Radar and Wireless Communications (MIKON) - Analytical crossing lines modelingDinh, Thanh Vinh; Pasquet, Daniel; Descamps, Philippe; Lesenechal, Dominique; Pagazani, Julien; Lissorgues, Gaelle; Nicole, Pierre · 2014

[IEEE 2011 Microwaves, Radar and Remote Sensing Symposium (MRRS) - Kiev, Ukraine (2011.08.25-2011.08.27)] 2011 MICROWAVES, RADAR AND REMOTE SENSING SYMPOSIUM - Modelling of an inductor on SiGe: From the measurement to the equivalent schemePasquet, Daniel; Descamps, Philippe; Lesenechal, Dominique; Nguyen-Tran, Linh; Bourdel, Emmanuelle; Quintanel, Sebastien · 2011

[IEEE 2013 81st ARFTG Microwave Measurement Conference (ARFTG) - Seattle, WA, USA (2013.06.7-2013.06.7)] 81st ARFTG Microwave Measurement Conference - On-wafer multi-port circuits characterization technique with a two-port VNAQuintanel, Sebastien; Pasquet, Daniel; Bourdel, Emmanuelle; Duperrier, Cedric; Lesenechal, Dominique; Dinh, Thanh-Vinh; Descamps, Philippe · 2013

[IEEE 2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - San Francisco, CA, USA (2016.5.22-2016.5.24)] 2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - Experimental characterization of packaged switch devices for RF and millimeter-Wave applicationsDinh, Thanh Vinh; Descamps, Philippe; Pasquet, Daniel; Lesenechal, Dominique; Wane, Sidina · 2016

[IEEE 2013 IEEE Radio and Wireless Symposium (RWS) - Austin, TX, USA (2013.01.20-2013.01.23)] 2013 IEEE Radio and Wireless Symposium - Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard ringsBen Salah, Miled; Pasquet, Daniel; Voiron, Frederic; Descamps, Philippe; Lefebvre, Jean-Luc; Lesenechal, Dominique · 2013