Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

• 作者Jicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt
• 卷第60卷
• 期第5期
• 印刷ISSN1359-6462
• 文件大小318.06KB
• 发表时间2009
• DOI10.1016/j.scriptamat.2008.10.029
• 页码333-335