[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Selective induction heating for wafer level bonding and packaging
- 作者Chen, Mingxiang; Liu, Wenming; Xi, Yanyan; Lin, Changyong; Wong, C. P.; Liu, Sheng
- 文件大小1583.28KB
- 发表时间2009
- DOI10.1109/ECTC.2009.5074253
- 页码1754-1758
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