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[IEEE 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Shenzhen, China (2009.01.5-2009.01.8)] 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Low temperature direct bonding for hermetic wafer level packaging

[IEEE 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Shenzhen, China (2009.01.5-2009.01.8)] 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Low temperature direct bonding for hermetic wafer level packaging

Lei Nie, ; Tielin Shi, ; Zirong Tang, ; Shiyuan Liu, ; Guanglan Liao,

作者Lei Nie, ; Tielin Shi, ; Zirong Tang, ; Shiyuan Liu, ; Guanglan Liao,
文件大小3201.37KB
发表时间2009
DOI10.1109/NEMS.2009.5068621
页码472-475

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