[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - The needs of multi-scale/multi-physics simulation for RF Power packaging/product development
- 作者Yuan, Cadmus; Zhang, G.Q.; Salta, Joey; Jos, Rik
- 文件大小251.46KB
- 发表时间2009
- DOI10.1109/esime.2009.4938497
- 页码1-1
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