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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study on microstructure and properties of Al/SiCp electronic packaging materials embedded metal components

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study on microstructure and properties of Al/SiCp electronic packaging materials embedded metal components

Zhang, Zhiqing; Zheng, Hongyu
  • 作者Zhang, Zhiqing; Zheng, Hongyu
  • 文件大小1737.55KB
  • 发表时间2009
  • DOI10.1109/icept.2009.5270655
  • 页码713-717
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