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A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication

A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication

Fei, Geng; Xiaoyun, Ding; Gaowei, Xu; Le, Luo

期刊名称Journal of Semiconductors
作者Fei, Geng; Xiaoyun, Ding; Gaowei, Xu; Le, Luo
卷第30卷
期第10期
印刷ISSN1674-4926
文件大小608.22KB
发表时间2009-10
DOI10.1088/1674-4926/30/10/106003

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