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[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Enhanced Microchannel Heat Sinks Using Oblique Fins

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Enhanced Microchannel Heat Sinks Using Oblique Fins

Lee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang
  • 作者Lee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang
  • 文件大小676.13KB
  • 发表时间2009
  • DOI10.1115/interpack2009-89059
  • 页码253-260
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