Electrodeposition and morphology analysis of Bi–Te thermoelectric alloy nanoparticles on copper substrate
- 作者Yong X. Gan; James Sweetman; Joseph G. Lawrence
- 卷第64卷
- 期第3期
- 印刷ISSN0167-577X
- 文件大小1014.38KB
- 发表时间2010
- DOI10.1016/j.matlet.2009.11.045
- 页码449-452
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