[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Modeling for defects impact on electrical performance of power packages
Liu, Yumin; Wu, Chung-Lin; Liu, Yong; Kinzer, Dan; Jeon, O S
- 作者Liu, Yumin; Wu, Chung-Lin; Liu, Yong; Kinzer, Dan; Jeon, O S
- 文件大小1405.17KB
- 发表时间2010
- DOI10.1109/ECTC.2010.5490942
- 页码403-410