海量图书期刊资源,随时随地畅享阅读乐趣
Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile testYanhong Tian; Wei Liu; Rong An; Wei Zhang; Lina Niu; Chunqing Wang · 2012
Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu padsTian, Yanhong; Zhang, Rui; Hang, Chunjin; Niu, Lina; Wang, Chunqing · Materials Characterization · 2014