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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The role of glaze in TPH analysis by CFD

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The role of glaze in TPH analysis by CFD

Hsiao, Clay; Huang, Baron; Su, Feimi
  • 作者Hsiao, Clay; Huang, Baron; Su, Feimi
  • 文件大小168.14KB
  • 发表时间2010
  • DOI10.1109/impact.2010.5699510
  • 页码1-4
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