[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Advanced virtual testing of structural integrity in microelectronic assemblies
- 作者Shirangi, M.H.; Otto, C.; Fischer, A.; van Staa, P.; Muller, W.H.; Michel, B.
- 文件大小1183.58KB
- 发表时间2010
- DOI10.1109/estc.2010.5642815
- 页码1-8
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