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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Modeling and analysis of electrothermal effects on global ULSI interconnects

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Modeling and analysis of electrothermal effects on global ULSI interconnects

Li, Xiaochun; Tong, Jialing; Shao, Yan; Mao, Junfa
  • 作者Li, Xiaochun; Tong, Jialing; Shao, Yan; Mao, Junfa
  • 文件大小287.23KB
  • 发表时间2010
  • DOI10.1109/edaps.2010.5683036
  • 页码1-4
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