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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging

Haifei Xiang, ; Jian Song, ; Fengman liu, ; Wei Gao, ; Li, Baoxia; Lixi Wan,

作者Haifei Xiang, ; Jian Song, ; Fengman liu, ; Wei Gao, ; Li, Baoxia; Lixi Wan,
文件大小626.94KB
发表时间2010
DOI10.1109/icept.2010.5582750
页码1158-1161

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