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The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solderPan, Chien-Cheng; Lin, Yu-Wei; Lin, Chien-I; Mittal, Jagjiwan; Lin, Kwang-Lung · Journal of Non-Crystalline Solids · 2015
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu SubstrateJagjiwan Mittal; Shih-Ming Kuo; Yu-Wei Lin; Kwang-Lung Lin · 2009