Metal–dielectric interface toughening by molecular nanolayer decomposition
- 期刊名称Journal of Applied Physics
- 作者Garg, Saurabh; Jain, Ashutosh; Karthik, C.; Singh, Binay; Teki, Ranganath; Smentkowski, V. S.; Lane, Michael W.; Ramanath, Ganpati
- 卷第108卷
- 期第3期
- 印刷ISSN0021-8979
- 文件大小1321.35KB
- 发表时间2010
- DOI10.1063/1.3437648
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