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Modeling of grain size effect on micro deformation behavior in micro-forming of pure copper

Modeling of grain size effect on micro deformation behavior in micro-forming of pure copper

W.L. Chan; M.W. Fu; J. Lu; J.G. Liu

作者W.L. Chan; M.W. Fu; J. Lu; J.G. Liu
卷第527卷
印刷ISSN0921-5093
文件大小1894.59KB
发表时间2010
DOI10.1016/j.msea.2010.07.009
页码6638-6648

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