[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement
Huang, P. S.; Lin, Y. H.; Huang, C. Y; Tsai, M. Y.; Huang, T. C.; Liao, M. C.
- 作者Huang, P. S.; Lin, Y. H.; Huang, C. Y; Tsai, M. Y.; Huang, T. C.; Liao, M. C.
- 文件大小2934.64KB
- 发表时间2010
- DOI10.1109/impact.2010.5699599
- 页码1-4