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[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Hot Spot Mitigating With Oblique Finned Microchannel Heat Sink

[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Hot Spot Mitigating With Oblique Finned Microchannel Heat Sink

Lee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang

作者Lee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang
文件大小384.75KB
发表时间2010
DOI10.1115/IMECE2010-37817
页码167-174

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