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Study on localized induction heating for wafer level packaging

Study on localized induction heating for wafer level packaging

YanYan Xi; XiaoBing Luo; WenMing Liu; MingXiang Chen; Sheng Liu

作者YanYan Xi; XiaoBing Luo; WenMing Liu; MingXiang Chen; Sheng Liu
卷第53卷
期第3期
印刷ISSN1674-7321
电子ISSN1869-1900
文件大小1185.84KB
发表时间2010-03
DOI10.1007/s11431-009-0314-y
页码800-806

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