Recap of the ITC15 Test ConferenceEklow, Bill · IEEE Design & Test · 2016

On Effective Through-Silicon Via Repair for 3-D-Stacked ICsJiang, Li; Xu, Qiang; Eklow, Bill · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2013

Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICsWang, Ran; Chakrabarty, Krishnendu; Eklow, Bill · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2014

A Distributed, Reconfigurable, and Reusable BIST Infrastructure for Test and Diagnosis of 3D-Stacked ICsAgrawal, Mukesh; Chakrabarty, Krishnendu; Eklow, Bill · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2015

[IEEE 2007 IEEE International Test Conference - Santa Clara, CA, USA (2007.10.21-2007.10.26)] 2007 IEEE International Test Conference - Boundary-scan: Built to last? Panel synopsisEklow, Bill · 2007

[IEEE 2012 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2012.11.5-2012.11.8)] 2012 IEEE International Test Conference - FALCON: Rapid statistical fault coverage estimation for complex designsMirkhani, Shahrzad; Abraham, Jacob A.; Vo, Toai; Jun, Hongshin; Eklow, Bill · 2012

[IEEE 2014 IEEE International Test Conference (ITC) - Seattle, WA, USA (2014.10.20-2014.10.23)] 2014 International Test Conference - A distributed, reconfigurable, and reusable bist infrastructure for 3D-stacked ICsAgrawal, Mukesh; Chakrabarty, Krishnendu; Eklow, Bill · 2014