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A model for squeeze-film damping of perforated MEMS devices in the free molecular regime

A model for squeeze-film damping of perforated MEMS devices in the free molecular regime

Li, Pu; Hu, Rufu
  • 期刊名称Journal of Micromechanics and Microengineering
  • 作者Li, Pu; Hu, Rufu
  • 卷第21卷
  • 期第2期
  • 印刷ISSN0960-1317
  • 电子ISSN1361-6439
  • 文件大小407.63KB
  • 发表时间2011-02-01
  • DOI10.1088/0960-1317/21/2/025006
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