Development of vacuum underfill technology for a 3D chip stack

• 期刊名称Journal of Micromechanics and Microengineering
• 作者Sakuma, Katsuyuki; Kohara, Sayuri; Sueoka, Kuniaki; Orii, Yasumitsu; Kawakami, Mikio; Asai, Kazuo; Hirayama, Yoshikazu; Knickerbocker, John U
• 卷第21卷
• 期第3期
• 印刷ISSN0960-1317
• 电子ISSN1361-6439
• 文件大小1324.38KB
• 发表时间2011-03-01
• DOI10.1088/0960-1317/21/3/035024