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Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches

Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches

Zhifeng Yang; Xu Wang; Na Li; Zhixiang Wang; Zenglin Wang
  • 作者Zhifeng Yang; Xu Wang; Na Li; Zhixiang Wang; Zenglin Wang
  • 卷第56卷
  • 期第9期
  • 印刷ISSN0013-4686
  • 文件大小545.33KB
  • 发表时间2011
  • DOI10.1016/j.electacta.2011.01.022
  • 页码3317-3321
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