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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A study in new fin pattern of stacked fin sink for heat convection enhancement

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A study in new fin pattern of stacked fin sink for heat convection enhancement

Hsiao, Clay; Chang, Brant

作者Hsiao, Clay; Chang, Brant
文件大小2486.26KB
发表时间2011
DOI10.1109/impact.2011.6117211
页码404-407

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