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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Temporary passivation of Cu for low temperature (< 300°C) 3D wafer stacking

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Temporary passivation of Cu for low temperature (< 300°C) 3D wafer stacking

Lim, D. F.; Wei, J.; Leong, K. C.; Tan, C. S.

作者Lim, D. F.; Wei, J.; Leong, K. C.; Tan, C. S.
文件大小529.07KB
发表时间2011
DOI10.1109/iitc.2011.5940337
页码1-3

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