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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire material

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire material

Premkumar, Jeromerajan; Gopinath, Maasi; Meng Yong Shie, ; Gary-TS Tay,
  • 作者Premkumar, Jeromerajan; Gopinath, Maasi; Meng Yong Shie, ; Gary-TS Tay,
  • 文件大小2735.44KB
  • 发表时间2011
  • DOI10.1109/eptc.2011.6184539
  • 页码805-809
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