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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Thermal stability and interface improvement of thin NiSiGe by C<sup>+</sup> ion implantation

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Thermal stability and interface improvement of thin NiSiGe by C⁺ ion implantation

Zhang, B.; Yu, W.; Zhao, Q.T.; Buca, D.; Hollander, B.; Hartmann, J.-M.; Zhang, M.; Wang, X.; Mantl, S.

作者Zhang, B.; Yu, W.; Zhao, Q.T.; Buca, D.; Hollander, B.; Hartmann, J.-M.; Zhang, M.; Wang, X.; Mantl, S.
文件大小392.93KB
发表时间2011
DOI10.1109/iitc.2011.5940344
页码1-3

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