FE-Simulation of the Heat Transfer by Defined Cooling Conditions during the Hot Stamping Process
- 期刊名称Key Engineering Materials
- 作者Svec, Thomas; Grüner, Martin; Merklein, Marion
- 卷第473卷
- 电子ISSN1662-9795
- 文件大小717.76KB
- 发表时间2011-3
- DOI10.4028/www.scientific.net/KEM.473.699
- 页码699-706
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