Analysis of Chip Damage Risk in Thermosonic Wire Bonding
- 期刊名称Key Engineering Materials
- 作者Dresbach, Christian; Lorenz, Georg; Petzold, Matthias; Altenbach, Holm
- 卷第478卷
- 电子ISSN1662-9795
- 文件大小3002.43KB
- 发表时间2011-4
- DOI10.4028/www.scientific.net/KEM.478.75
- 页码75-80
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