ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Room Temperature Copper Seed Layer Deposition by Plasma-Enhanced Atomic Layer Deposition

• 作者Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian
• 印刷ISSN1938-5862
• 文件大小1052.85KB
• 发表时间2011
• DOI10.1149/1.3568854
• 页码125-132