Investigation of Thermal and Hot-Wire Chemical Vapor Deposition Copper Thin Films on TiN Substrates Using CupraSelect® as Precursor
- 期刊名称Journal of Nanoscience and Nanotechnology
- 作者Papadimitropoulos, G.; Davazoglou, D.
- 卷第11卷
- 期第9期
- 印刷ISSN1533-4880
- 电子ISSN1533-4899
- 文件大小2875.78KB
- 发表时间2011-09-01
- DOI10.1166/jnn.2011.5055
- 页码8169-8173
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