Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications
- 作者Ximin Zhang; Hong Guo; Fazhang Yin; Yeming Fan; Yongzhong Zhang
- 卷第30卷
- 期第1期
- 印刷ISSN1001-0521
- 电子ISSN1867-7185
- 文件大小1246.38KB
- 发表时间2011-02
- DOI10.1007/s12598-011-0204-x
- 页码94-98