[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems -
- 作者Brinkfeldt, Klas; Formanek, Jan; Laposa, Alexander; Jakovenko, Jiri; Adolfsson, Erik; Johander, Per
- 文件大小1059.58KB
- 发表时间2012
- DOI10.1109/esime.2012.6191730
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