Challenges and developments of copper wire bonding technology
- 作者Peisheng Liu; Liangyu Tong; Jinlan Wang; Lei Shi; Hao Tang
- 卷第52卷
- 期第6期
- 印刷ISSN0026-2714
- 文件大小689.60KB
- 发表时间2012
- DOI10.1016/j.microrel.2011.12.013
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