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Microstructure evolution and thermal properties in FeMoPCB alloy during mechanical alloying

Microstructure evolution and thermal properties in FeMoPCB alloy during mechanical alloying

C. Yang; T. Wei; J. Zeng; L.H. Liu; S.G. Qu; Y.Y. Li

作者C. Yang; T. Wei; J. Zeng; L.H. Liu; S.G. Qu; Y.Y. Li
卷第358卷
印刷ISSN0022-3093
文件大小1890.92KB
发表时间2012
DOI10.1016/j.jnoncrysol.2012.03.024

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