Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding

• 期刊名称Journal of Microelectromechanical Systems
• 作者Wu, Guoqiang; Xu, Dehui; Xiong, Bin; Wang, Yuchen; Wang, Yuelin; Ma, Yinglei
• 卷第21卷
• 期第6期
• 印刷ISSN1057-7157
• 电子ISSN1941-0158
• 文件大小1428.99KB
• 发表时间2012-12
• DOI10.1109/jmems.2012.2211572
• 页码1484-1491