Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations
- 作者Emeka H. Amalu; Ndy N. Ekere
- 卷第52卷
- 期第11期
- 文件大小3427.10KB
- 发表时间2012
- DOI10.1016/j.microrel.2012.04.004
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