Microstructure and properties of Al/Si/SiC composites for electronic packaging
- 作者Xiao-min ZHU; Jia-kang YU; Xin-yu WANG
- 卷第22卷
- 期第7期
- 文件大小749.86KB
- 发表时间2012
- DOI10.1016/s1003-6326(11)61374-5
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