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[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Efficient analysis of radiated immunity of printed circuit boards using SPICE

[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Efficient analysis of radiated immunity of printed circuit boards using SPICE

Zhao, Huapeng; Gao, Xianke; Wang, Binfang; Li, Erping; Chua, Eng Kee
  • 作者Zhao, Huapeng; Gao, Xianke; Wang, Binfang; Li, Erping; Chua, Eng Kee
  • 文件大小476.38KB
  • 发表时间2012
  • DOI10.1109/ISEMC.2012.6351768
  • 页码289-293
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