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The Effects of Device Dimension, Substrate Temperature, and Gate Metallization on the Reliability of AlGaN/GaN High Electron Mobility Transistors

The Effects of Device Dimension, Substrate Temperature, and Gate Metallization on the Reliability of AlGaN/GaN High Electron Mobility Transistors

Ren, F.; Pearton, S. J.; Liu, Lu; Kang, T.-S.; Douglas, E. A.; Chang, C. Y.; Lo, C.-F.; Cullen, D. A.; Zhou, L.; Smith, D. J.
  • 期刊名称MRS Proceedings
  • 作者Ren, F.; Pearton, S. J.; Liu, Lu; Kang, T.-S.; Douglas, E. A.; Chang, C. Y.; Lo, C.-F.; Cullen, D. A.; Zhou, L.; Smith, D. J.
  • 卷第1396卷
  • 电子ISSN1946-4274
  • 文件大小1219.24KB
  • 发表时间2012-1
  • DOI10.1557/opl.2012.354
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