[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Development of low temperature Chip-on-Flex (COF) bonding process of 100°C
- 作者Kim, Sun-Chul; Kim, Young-Ho
- 文件大小495.27KB
- 发表时间2012
- DOI10.1109/emap.2012.6507904
- 页码1-3
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[IEEE International Congress on Instrumentation in Aerospace Simulation Facilities, - St. Louis, France (September 20-23, 1993)] International Congress on Instrumentation in Aerospace Simulation Facilities, - Cryogenic Instrumentation Target of 0.01% Accuracy achievedScurlock, R.G.S.; Webb, R. · 1993