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[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

Nimura, Masatsugu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun
  • 作者Nimura, Masatsugu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun
  • 文件大小744.83KB
  • 发表时间2012
  • DOI10.1109/ltb-3d.2012.6238052
  • 页码81-81
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