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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints

Zeng, Jing-Bo; Xu, Guang-Sui; Zhou, Min-Bo; Zhang, Xin-Ping
  • 作者Zeng, Jing-Bo; Xu, Guang-Sui; Zhou, Min-Bo; Zhang, Xin-Ping
  • 文件大小1889.49KB
  • 发表时间2012
  • DOI10.1109/emap.2012.6507872
  • 页码1-5
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