[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Process integration and testing of TSV Si interposers for 3D integration applications

Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Goodwin, S.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D.

作者Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Goodwin, S.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D.
文件大小859.43KB
发表时间2012
DOI10.1109/ectc.2012.6248839
页码268-273

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