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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability evaluation of GaN based light-emitting diodes under high-temperature stressing

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability evaluation of GaN based light-emitting diodes under high-temperature stressing

Fu, Meijuan; Yin, Luqiao; Weng, Fei; Yang, Lianqiao; Zhang, Jianhua

作者Fu, Meijuan; Yin, Luqiao; Weng, Fei; Yang, Lianqiao; Zhang, Jianhua
文件大小539.02KB
发表时间2012
DOI10.1109/icept-hdp.2012.6474835
页码1262-1265

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