[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - The thermal stress analysis in 3D IC integration with TSV interposer
- 作者Pang, Junwen; Wang, Jun
- 文件大小1609.96KB
- 发表时间2012
- DOI10.1109/icept-hdp.2012.6474718
- 页码725-730
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