[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Characterization of mechanical testing on lead free solder on electronic application
- 作者Ervina, Efzan M.N.; Singh, Amares
- 文件大小4323.57KB
- 发表时间2012
- DOI10.1109/iemt.2012.6521780
- 页码1-9
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