[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigate the microstructure changes in Cu through-silicon vias (TSVs) under thermal process
- 作者Zhang, Zhaoqiang; Pang, Junwen; Wang, Jun; Song, Chongshen; Yu, Daquan
- 文件大小1133.67KB
- 发表时间2012
- DOI10.1109/icept-hdp.2012.6474643
- 页码398-400
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